Automatic Inspection Device "BMW Series"
An automatic inspection device that quickly maps defect information that induces yield reduction.
The "BMW Series" is an automatic inspection device that detects microscopic surface defects occurring on the backside of wafers during the device manufacturing process with high sensitivity and speed, quickly mapping defect information that can lead to yield loss in subsequent processes such as exposure and CMP. Additionally, in the review station, three-dimensional automatic measurements using a laser microscope are performed on candidate defects extracted from macro inspection, providing users with detailed data such as defect P-V values, contributing to process stabilization. 【Features】 ■ High sensitivity and speed in detecting microscopic surface defects (chuck marks, discharge marks, dents, contact marks, etc.) ■ Full backside inspection (EE=1mm) ■ Candidate defect extraction using image processing and masks ■ Wide dynamic range and high processing capability ■ Automatic defect review and 3D measurement using a confocal microscope *For more details, please refer to the PDF document or feel free to contact us.
- Company：オプティマ https://www.optima-1.co.jp/
- Price：Other
